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Reliability of Pb-free Soldered Joints for Automotive Applications

Article of Honda R&D Technical Review Vol.12 No.1


Tests were conducted to evaluate the grain growth rate of the structure and the intermetallic compound layer fracture rate. These tests included the physical properties, as well as peeling, which is a mechanical property of Pb free soldered joints. In addition, thermal shock tests (acceleration tests) were performed to evaluate the life span as related to thermal fatigue.
First, the grain growth rate and intermetallic compound layer fracture rate of the Pb-free soldered structure were confirmed to follow the rule of parabolic curves. Next, the life span of Pb-free soldered joints under market conditions was predicted using Miner’s rule of reliability engineering based on the effects of heat stress obtained through acceleration tests and the heat stress frequency in an automotive application.


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Author (organization or company)

Toshihiro OKAMA(Tochigi R&D Center)、Kazuhiko HIRATA(Senjyu Metal Industry)

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