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Reliability of Pb-free Soldered Joints for Automotive Applications

Article of Honda R&D Technical Review Vol.12 No.1

Summary

Tests were conducted to evaluate the grain growth rate of the structure and the intermetallic compound layer fracture rate. These tests included the physical properties, as well as peeling, which is a mechanical property of Pb free soldered joints. In addition, thermal shock tests (acceleration tests) were performed to evaluate the life span as related to thermal fatigue.
First, the grain growth rate and intermetallic compound layer fracture rate of the Pb-free soldered structure were confirmed to follow the rule of parabolic curves. Next, the life span of Pb-free soldered joints under market conditions was predicted using Miner’s rule of reliability engineering based on the effects of heat stress obtained through acceleration tests and the heat stress frequency in an automotive application.

Reference

(1) Rikiya Kato: For Environmental Problems about The Practical use of Solder, SMIC R & D Report, Senju Metal Industry Co., Ltd., p.13(1998) (Written in Japanese)
(2) Tadashi Takemoto, Ryouhei Sato: High Reliability Microsoldering Technology, Kogyo Chosakai Publishing Co., Ltd., Tokyo, p.3-319(1991) (Written in Japanese)
(3) Kimio Degawa, Hirohiko Watanabe, Keiichi Matsumura: Effect of Pre-coating on Substrates to Pb free Solder Joint Strength, 3rd Symposium on Microjoining and Assembly Technology in Electronics, p.52-54(1997) (Written in Japanese)
(4) Toshihiro Okama: Grain Growth Speed of the Eutectic Structure of Solder, Preprints of The National Meeting of J. W. S. No.58 Spring, 1996, Journal of the Japan Welding Society, P.248-249(1996) (Written in Japanese)
(5) Keiichiro Suetsugu: practical use and Development Problem of Pb free Solder, 27th INTERNEPCON JAPAN, Kogyo Chosakai Publishing Co., Ltd., Tokyo, p.44(1998) (Written in Japanese)
(6) Goro Mori: Reliability Management Handbook for Quality Assurance, Chapter of Reliability Management Handbook Collection Committee, Japanese Standard Association, p.176-177, p.206(1985) (Written in Japanese)
(7) Masato Moriyama: Reliability of Soldered Joints for Automotive Electronic Devices HONDA R&D Technical Review, Vol.9, p.156-166(1997) (Written in Japanese)

Author (organization or company)

Toshihiro OKAMA(Tochigi R&D Center)、Kazuhiko HIRATA(Senjyu Metal Industry)

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