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Development of Chlorine-free Waterborne Primer for Bumper

Article of Honda R&D Technical Review Vol.20 No.2


Changes in the production process of the polyolefin substrate used on automotive bumpers have created the need for increased coating adhesion performance. A method of lowering the melting point of polyolefin, the principal component of the primer, in order to fuse the polyolefin resin with the polypropylene (PP) substrate using the heat generated during pre-heating and baking, thus achieving increased adhesion through the interaction force between molecules, was therefore examined. Using a metallocene catalyst, the tacticity of the polyolefin was controlled and its melting point reduced, resulting in the achievement of a higher level of adhesion intensity than the conventional primer. The chlorine that was formerly added to the olefin is no longer used, reducing the burden on the environment.


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(2) Saeki, Y., Ogawa,T.: Development of High Modulus Polypropylene and Paint for Thin Wall Bumper Facia, HONDA R&D Technical Review, Vol. 9, p. 213-219
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(5) Shibuya, E., Suzuki, M., Fujii, S.: Environment. Behavior of Dioxin Emissions from Municipal Solid Waste Incinerators., NKK Technical Report, No. 166, p. 16-20 (1999)

Author (organization or company)

Takanori HASHIMOTO(Automobile R&D Center)、Takeshi OGAWA(Automobile R&D Center)

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